A sub-micron-gap SOI capacitive accelerometer array utilizing size effect
MEMS capacitive accelerometers have been widely used for consumer and automobile applications. Our purpose is high sensi […]
Daily Archives: Monday March 23rd, 2015
High-temperature mechanical property of single crystal silicon microstructures
Understanding of high-temperature mechanical property is necessary for the reliability of MEMS in harsh environments. Si […]
Tensile strength of single crystal silicon microstructures
Silicon is a standard material of MEMS. Since MEMS devices need mechanical deformations for their operations, evaluation […]
Tensile test of silicon nanowire by using electrostatic MEMS device
Silicon nanowire has excellent mechanical and electrical properties and is expected to be applies as nanostructure eleme […]
Selective assembly of DNA origami bridging over a trenched Si substrate
We demonstrated for the first time the versatility of the integration method of DNA origami on MEMS by selectively assem […]
Characterization of ssDNA modified CNTs
Carbon nanotube (CNT) is expected to be applied to elements of nano devices because of its attractive properties. We are […]
Mechanical properties characterization of DNA origami
DNA origami is one of the most promising methods to form nano-scale structures or Nano/micro systems. However the effect […]
Process Parameter Optimizer
Grayscale lithography has been attracting huge attention recent years as a solution to 3D microstructuring for MEMS appl […]
