IFCS-EFTF 2015
The 2015 Joint Conference of the IEEE International Frequency Control Symposium & European Frequency and Time Forum […]
Monthly Archives: March 2015
A sub-micron-gap SOI capacitive accelerometer array utilizing size effect
MEMS capacitive accelerometers have been widely used for consumer and automobile applications. Our purpose is high sensi […]
High-temperature mechanical property of single crystal silicon microstructures
Understanding of high-temperature mechanical property is necessary for the reliability of MEMS in harsh environments. Si […]
Tensile strength of single crystal silicon microstructures
Silicon is a standard material of MEMS. Since MEMS devices need mechanical deformations for their operations, evaluation […]
Tensile test of silicon nanowire by using electrostatic MEMS device
Silicon nanowire has excellent mechanical and electrical properties and is expected to be applies as nanostructure eleme […]
Selective assembly of DNA origami bridging over a trenched Si substrate
We demonstrated for the first time the versatility of the integration method of DNA origami on MEMS by selectively assem […]
Characterization of ssDNA modified CNTs
Carbon nanotube (CNT) is expected to be applied to elements of nano devices because of its attractive properties. We are […]
Mechanical properties characterization of DNA origami
DNA origami is one of the most promising methods to form nano-scale structures or Nano/micro systems. However the effect […]
Process Parameter Optimizer
Grayscale lithography has been attracting huge attention recent years as a solution to 3D microstructuring for MEMS appl […]
MEMS device for heat transfer measurement using nanogap
In recent years, nano-gap electrodes are reported to realize high efficient thermoelectric generators. To evaluate elect […]
IEEE-NEMS 2015
IEEE-NEMS 2015 (http://www.ieee-nems.org/2015/) will be held in Xi’an, China, from 7 to 11 April 2015. This conference i […]