Fabrication process effect on torsional strength of SCS beam for resonant mirror devices

There are two types of fabrication processes for MEMS torsional mirror device. One is the process using SOI wafer, and the other is the process using Si wafer. Cross-sectional shape of mirror device and cost is different between them. The research objective is to evaluate the fabrication process dependence of the strength and the fatigue lifetime of MEMS torsional mirror device.

[Applications] Development of MEMS devices with low cost and high reliability