Member, Research topics updated
Member list update. Research topics added.
Daily Archives: Friday April 1st, 2016
Thermodynamics and mechanical properties characterization of DNA origami structures based on AFM
DNA origami is increasingly attractive for the construction of large scale architecture that can arrange a variety of na […]
Tensile testing of silicon covered with DLC film
DLC (Diamond Like Carbon) film is one of the promising coating material in MEMS industry deal to its many desirable pro […]
Immobilization of DNA origami onto silicon substrate
MEMS device needs to be enhance its functionality by integration of a wide variety of nano-material such as metal nanopa […]
Electromagnetic-driven deformable mirror device
Adaptive optics is a significant device that corrects the wavefront aberrations. This system is composed of deformable m […]
MEMS Deformable Mirror Actuated By Electrostatic Piston Array
Inspection light of funduscopy is warped by distortion of eyeball. So deformable mirrors (DMs) to correct light instantl […]
parallel tensile testing of silicon with integrated strain gauge
In order to shorten a testing time for evaluation of tensile-mode fatigue properties of single crystal silicon, we have […]
High-temperature mechanical property of single crystal silicon microstructures
Understanding of high-temperature mechanical property is necessary for the reliability of MEMS in harsh environments. Si […]
Tensile strength of single crystal silicon microstructures
Silicon is a standard material of MEMS. Since MEMS devices need mechanical deformations for their operations, evaluation […]
２D array formation of DNA origami
DNA origami that is the way to make nano-scale structure has some characteristics, arranging nano-material on DNA origam […]
On-chip size-separtion of DNA nanostructures
The aim of this research is to establish microfluidic system to perform size-separation of biomolecules such as DNA and […]
3D lithography simulator for thick negative photoresist
Lithography has been attracting huge attention recent years as a solution to 3D microstructuring for MEMS applications. […]
