Understanding of high-temperature mechanical property is necessary for the reliability of MEMS in harsh environments. Single crystal silicon is one of standard materials in MEMS, and changes fracture behavior from brittle to ductile at high temperature. This research focuses on the size effect on BDTT (brittle-ductile transition temperature) and investigates it by means of tensile testing in vacuum with a concentrated IR heating.
- Database of fracture strength of single crystal silicon
- Design guideline of MEMS devices with higher reliability
- A. Uesugi, Y. Hirai, T. Yasutomi, T. Tsuchiya, and O. Tabata, Jpn. J. Appl. Phys., 2015, Vol. 54, 06FP04.
- A. Uesugi, Y. Hirai, T. Tsuchiya, and O. Tabata, The 28th IEEE International Conference on Micro Electro Mechanical Systems, MEMS2015.