Chip self-assembling using DNA hybridization

Self-assembly has the possibility to implement a minute part effectively of the micro,nano meter scale, so it attracts attention while a lot of studies about the implementation technology of MEMS(Micro Electro Mechanical Systems) are performed. We focus attention on the self-assembly that applying DNA as intelligent adhesive, because it has the possibility that realizes good self-assembly of the efficiency and the shape that is more complicated than the precedent study about the self-assembly. Aiming at this technical practical use, the purpose in this study is the measurement of adhesive force between the micrometer scale components and the substrate which assembled with DNA.