Nanogap device for thermionic generation
![Thumbnail of post image 017](https://www.nms.me.kyoto-u.ac.jp/nms/wp-content/uploads/2020/07/bun-150x150.jpg)
Devices and an external mechanism capable of nanogap formation, measurement of gap distance and curr ...
Dynamic Stress Measurement of Silicon
![Thumbnail of post image 076](https://www.nms.me.kyoto-u.ac.jp/nms/wp-content/uploads/2014/10/kogita-150x150.jpg)
MEMS are often used in various products under vibrating environment. In order to improve the reliabi ...
Tensile testing of silicon at high temperature
![Thumbnail of post image 120](https://www.nms.me.kyoto-u.ac.jp/nms/wp-content/uploads/2014/10/uesugi-150x150.jpg)
Structural materials of MEMS are silicon, silicon compound, and so on. Silicon’s mechanical property ...
Reliability evaluation of silicon microstructure
![Thumbnail of post image 198](https://www.nms.me.kyoto-u.ac.jp/nms/wp-content/uploads/2014/10/uesugi-1-150x150.jpg)
Silicon is a widely-used material for MEMS devices structure. It is a brittle material, so its mecha ...