InterPACK 2013 (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems) will be held in San Francisco on July 16-18. This conference is an international forum for exchange of state-of-the art knowledge in research, development, manufacturing, and application on the packaging and integration of Electronic and Photonic Microsystems.
Conference HP: https://www.asmeconferences.org/InterPACK2013/index.cfm
1 abstract from Tabata lab. was accepted by the technical program committee for the presentation. Authors and title of the paper is:
- MEMS and NEMS
A. Uesugi, Y. Hirai, K. Sugano, T. Tsuchiya, O. Tabata
Fractography Analysis Of Tensile Tested (110) Silicon Prepared By Different Surface Morphology And Crystal Orientations
Fractography Analysis Of Tensile Tested (110) Silicon Prepared By Different Surface Morphology And Crystal Orientations