(April 4 @ 14:30) Installation of experiential equipments／実験機器搬入
研究室各位 平井です。 ４月４日（月）の午後２時半〜、 実験室に添付ファイルの装置・機器を搬入します。 搬入時にはご迷惑おかけすると思いますが、 ご理解とご協力をお願いします。 なおこれらの全装置、各自の研究で自由に使ってください。 以上。 […]
Daily Archives: Friday April 1st, 2016
I add new B4 member to the mailing list “all” and “student”
(English version below) ￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣ 研究室のみなさん ※４回生のみんさんは、このメールを受け取ったら 受信確認のメールを平井まで送信してください。 平井です。 […]
Lab Website Updated
Dear all, Thank you for preparing materials for our lab website. Now most of them have been updated on research pages. P […]
Member, Research topics updated
Member list update. Research topics added.
Thermodynamics and mechanical properties characterization of DNA origami structures based on AFM
DNA origami is increasingly attractive for the construction of large scale architecture that can arrange a variety of na […]
Tensile testing of silicon covered with DLC film
DLC (Diamond Like Carbon) film is one of the promising coating material in MEMS industry deal to its many desirable pro […]
Immobilization of DNA origami onto silicon substrate
MEMS device needs to be enhance its functionality by integration of a wide variety of nano-material such as metal nanopa […]
Electromagnetic-driven deformable mirror device
Adaptive optics is a significant device that corrects the wavefront aberrations. This system is composed of deformable m […]
MEMS Deformable Mirror Actuated By Electrostatic Piston Array
Inspection light of funduscopy is warped by distortion of eyeball. So deformable mirrors (DMs) to correct light instantl […]
parallel tensile testing of silicon with integrated strain gauge
In order to shorten a testing time for evaluation of tensile-mode fatigue properties of single crystal silicon, we have […]
High-temperature mechanical property of single crystal silicon microstructures
Understanding of high-temperature mechanical property is necessary for the reliability of MEMS in harsh environments. Si […]
Tensile strength of single crystal silicon microstructures
Silicon is a standard material of MEMS. Since MEMS devices need mechanical deformations for their operations, evaluation […]
